目前陶瓷基板的高散熱性能及穩(wěn)定性越來越受到大功率器件的青睞, 為了滿足陶瓷基板的高速打孔及劃線\切割需求, 我們特推出了雙工位激光精密陶瓷打孔切割專用機(jī)M3。
該設(shè)備使用高功率、長壽命的光纖激光器為光源，可以輕松實(shí)現(xiàn) 打孔、劃線及切割的需求。 為了進(jìn)一步提高設(shè)備的使用效率，特配置了雙工位工作臺(tái)，最大限度的提高操作效率。
At present, the high heat dissipation performance and stability of ceramic substrate are more and more favored by high-power devices. In order to meet the needs of high-speed drilling and marking of ceramic substrate, we have introduced a special machine for dual-station laser precision ceramic drilling and cutting.
The device uses a high-power and long-life optical fiber laser as a source, so that the requirements of drilling, marking and cutting can be easily realized. In order to further improve the use efficiency of the equipment, the double-station working table is specially configured, and the operation efficiency is improved to the maximum extent.
項(xiàng)目
參數(shù)
型號(hào) Model
M3
激光波長 Wavelength
~1070nm
峰值功率 Peak Power
1500W
平均功率 Average Power
200W
切割方式 Cutting Method
切割頭 Cutting Head
工作行程 Working Area
400X400mm
工位 Station
2（滿足 5 寸）
設(shè)備尺寸
Machine Dimension
1400X1250X1650mm
工作電壓/功率 Voltage/Power
380VAC /~3KW
重量 Weight
1200kg
加工效果
技術(shù)特征
高功率長壽命工業(yè)光纖激光器
激光器性能穩(wěn)定，光斑質(zhì)量好，可滿足板陶瓷應(yīng)用的絕大多數(shù)切割應(yīng)用
龍門雙驅(qū)平臺(tái)，結(jié)構(gòu)緊湊、工作效率高
友好的設(shè)備操作軟件
基于 Windows 的操作界面，操作簡單、友好
自動(dòng)匹配靶標(biāo)，多數(shù)靶標(biāo)不需要設(shè)置；一次加工接受不同直徑靶標(biāo)
自動(dòng)漲縮補(bǔ)償
適合皮秒等超短脈沖激光高頻的脈沖控制、深度控制功能
加工過程焦點(diǎn)自動(dòng)補(bǔ)償功能
加工過程，散熱控制功能
全幅面精度補(bǔ)償
用戶分級管理
加工參數(shù)分級管理
功率補(bǔ)償功能
配合自動(dòng)化
專業(yè)軟件優(yōu)化/生成切割路徑
可解析多種常用文件格式，同時(shí)具備圖形優(yōu)化及特殊功能的路徑生成功能。
圖形靶標(biāo)自動(dòng)識(shí)別
雙工位工作臺(tái)
PRODUCT FEATURES
High power and long life industrial fiber laser
The laser has stable performance and good spot quality, which can meet the needs of most cutting applications of plate ceramics.
The gantry double-drive platform has the advantages of compact structure and high working efficiency.
The operation interface based on Windows is simple and friendly.
Automatic matching target, most targets do not need to be set; accept different diameter targets in one processing.
Automatic compensation for fluctuation and contraction.
Suitable for picosecond and other ultra-short pulse laser high frequency pulse control and depth control function.
Automatic compensation function during processing.
Heat dissipation control function during processing.
Full-breadth precision compensation.
User hierarchical management.
Hierarchical management of processing parameters.
Power compensation function.
Professional software optimization/ generation of cutting path
Can resolve a variety of common file formats, and have the path generation capability of drawing optimization and special functions.
Image target automatic identification.
Double station worktable.
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