特征:
1. 皮秒激光設(shè)備同納秒激光設(shè)備相比，相對的熱影響區(qū)域大大減小，更有利于精密加工。
2. 加工表面更加光滑。
3. 除了電路板加工以外，皮秒設(shè)備也可以加工陶瓷，硅片，鐵氟龍等材料
Characteristics:
1. Compared to nano laser equipment, pico laser significantly reduces the heat effected area, which is better for precision processing.
2. The processing surface is smoother.
3. Apart from PCB processing, pico equipment can also be used in ceramic, silicon, teflon, etc.
規(guī)格：
|
規(guī)格 Specification |
|
|
激光類型Laser Type |
UV Pico Laser / 255nm |
|
平均輸出功率Avg. Out Power |
>15w@200 KHz |
|
掃描范圍和方法 Scan Scope & Method |
Advanced 2D on the fly |
|
X-Y平臺 X-Y stage |
分開的平臺，無芯線性驅(qū)動 Split Stage, Coreless Linear Motor |
|
面板尺寸 Panel Size |
650mm X 650mm |
|
切割精度Cutting Accuracy |
±10μm @avg |
|
裝載機(jī)Loader/Un-Loader |
附加選項（片對片 & 卷對卷） Additional Option (Sheet to Sheet & Roll to Roll |
|
電力供應(yīng) Electric Power |
220V, 3-phase, 50/60 Hz |
加工效果 Effects:
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